XE0304 series apply to digital X-ray imaging in human dental, vet dental and industrial NDT areas. The integrated CMOS sensor chip is with 18.5x18.5 um pixel size and total 2.65 Mega pixels (1402x1888), coupled with 6 um FOP can be optional in design to improve the image resolution and to prevent the X ray radiation on the CMOS chip and peripheral circuit so as to prolong the product life. Optional scintillators help to effectively balance the sensitivity and resolution in different applications. Combined with USB readout circuit and corresponding cables, its CMOS chip has been embedded with 14bit ADC circuit.

The SDK could be provided for customer's further development. A variety of OEM/ODMcustomization options are available.


Applications:

Intraoral digital X-ray diagnosis，NDT inspection，Vet dental, General X-ray imaging

3D X-ray applications
Product Detail
Thea XE0304

Thea XE0304

Solution
Image
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Optional style




Optional configuration



Model

Scintillator

Remarks

XE0304-G

GOS / High-resolution

Image Sensor

XE0304-C

CsI-HL / High-light-output

Image Sensor

XE0304-H

CsI-HR / High-resolution

Image Sensor



XE0304 module - optional FOP



Customized solutions

Provide more flexible customized CMOS design solutions to meet various needs:

1) 3 styles available: Middle Control Box, Rear Control Box, Direct USB2.0;

2) Optional parameter specifications: Equipped with different scintillator, optional FOP;

3) Appearance customization: The sensor head shell and control box shell are redesigned;

4) Cable length customization: Cable length can be customized according to needs;

5) Mobile solution: Type-C data output is optional, used for Android systems (Pad and mobile phone devices);


Welcome to consult for more detailed plans.

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X-CMOS PHOTONICS CO., LTD