NE0304 series apply to digital X-ray imaging in industrial NDT areas. The integrated CMOS sensor chip is with 18.5x18.5 um pixel size and total 2.65 Mega pixels (1888x1402), coupled with 6 um FOP to improve the image resolution and to prevent the X ray radiation on the CMOS chip and peripheral circuit so as to prolong the product life. Gos or CsI scintillator is for choice as needed, enable image output with high sensitivity and high resolution. Combined with USB3.0 readout circuit and GigE is for optional, its CMOS chip has been embedded with 14bit ADC circuit.
The SDK could be provided for customer's further development. A variety of OEM/ODM customization options are available.

NET inspection, 3D Imaging, Ultra-HD industrial CT system